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| STTH8R04 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (typ) 8A 400 V K A K 175 C 0.9 V 25 ns K A K A Features and benefits TO-220AC STTH8R04D TO-220FPAC STTH8R04FP Very low switching losses High frequency and high pulsed current operation High junction temperature Insulated packages - TO-220AC Ins Electrical insulation = 2500 V RMS Capacitance = 7 pF - TO-220FPAC Electrical insulation = 1500 V RMS Capacitance = 12 pF NC K K A A D PAK STTH8R04G 2 TO-220AC Ins STTH8R04DI Description The STTH8R04 series uses ST's new 400 V planar Pt doping technology. The STTH8R04 is specially suited for switching mode base drive and transistor circuits. Packaged in through-the-hole and surface mount packages, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. Order codes Part Number STTH8R04D STTH8R04DI STTH8R04FP STTH8R04G STTH8R04G-TR Marking STTH8R04D STTH8R04DI STTH8R04FP STTH8R04G STTH8R04G March 2007 Rev 1 1/11 www.st.com Characteristics STTH8R04 1 Table 1. Symbol VRRM VRSM IF(RMS) Characteristics Absolute ratings (limiting values at 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage Repetitive peak reverse voltage TO-220AC / RMS forward current TO220AC Ins TO-220AC / D2PAK IF(AV) Average forward current, = 0.5 TO220FPAC TO220AC Ins IFRM IFSM Tstg Tj Repetitive peak forward current Surge non repetitive forward current tp = 10 ms Sinusoidal Storage temperature range Operating junction temperature range Tc = 145 C Tc = 110 C Tc = 115 C tp = 10 s, F = 1 kHz 165 120 -65 to +175 -40 to +175 A A C C 8 A 20 D2 PAK / TO220FPAC Value 400 400 30 A Unit V V Table 2. Thermal parameters Parameter TO-220AC / D2PAK Value 2.5 6 5.5 C/W Unit Symbol Rth(j-c) Junction to case TO220FPAC TO220AB Ins Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 10 A 10 100 1.5 IF = 8 A 1.05 0.9 1.3 1.1 V Unit VF (2) Forward voltage drop Tj = 100 C Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.83 x IF(AV) + 0.034 x IF2(RMS) 2/11 STTH8R04 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Min Typ 35 25 5.5 0.4 150 2.9 ns V Max 50 ns 35 8 A Unit trr Reverse recovery time IRM S tfr VFP Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/s, VR = 320 V, Tj = 125 C IF = 8 A, dIF/dt = -200 A/s, VR = 320 V, Tj = 125 C IF = 8 A, dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 8 A, dIF/dt = 100 A/s Figure 1. P(W) 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 Conduction losses versus average current =0.05 =0.1 =0.2 =0.5 =1 Figure 2. IFM(A) Forward voltage drop versus forward current 200 180 160 140 120 100 80 60 T TJ=150C (Maximum values) TJ=150C (Typical values) 40 IF(AV)(A) 3 4 5 6 7 8 =tp/T 9 10 tp 20 0 11 TJ=25C (Maximum values) VFM(V) 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration TO-220FPAB Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AC TO-220AC Ins DPAK Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220FPAB 0.1 tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00 tp(s) 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 3/11 Characteristics STTH8R04 Figure 5. IRM(A) IF= 8 A VR=320 V Peak reverse recovery current versus dIF/dt (typical values) Figure 6. tRR(ns) Reverse recovery time versus dIF/dt (typical values) IF= 8 A VR=320 V 12 11 10 9 8 7 6 5 4 3 2 1 0 140 120 100 80 Tj=125 C 60 40 Tj=25 C Tj=125 C Tj=25 C 20 dIF/dt(A/s) 0 10 100 1000 dIF/dt(A/s) 10 100 1000 Figure 7. Reverse recovery charges versus dIF/dt (typical values) Figure 8. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, eCU=35m) DPAK 200 180 160 QRR(nC) IF= 8 A VR=320 V Rth(j-a) (C/W) 80 70 60 140 120 100 80 60 40 20 0 10 100 1000 Tj=25 C Tj=125 C 50 40 30 20 10 dIF/dt(A/s) 0 0 2 4 6 8 SCU(cm) 10 12 14 16 18 20 4/11 STTH8R04 Characteristics Figure 9. Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus dIF/dt (typical values) 5.0 4.5 4.0 1.4 1.2 1.0 0.8 0.6 QRR [Tj]/QRR [Tj = 125 C] and IRM [Tj]/IRM [Tj = 125 C] IF= 8 A VR=320 V VFp(V) IF=8 A Tj=125 C 3.5 IRM 3.0 2.5 2.0 QRR 0.4 0.2 T j(C) 0.0 25 50 75 100 125 150 1.5 1.0 0.5 0.0 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/s) Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values) reverse voltage applied (typical values) 700 600 500 400 300 200 100 0 0 100 200 300 400 500 dIF/dt(A/s) VR(V) 10 1 10 100 1000 tFR(ns) IF=8 A VFR=1.1 x V F max. Tj=125C C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C 5/11 Package information STTH8R04 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC, TO-220AC Ins, TO-220FPAC) Maximum torque value: 0.70 Nm (TO-220AC, TO-220AC Ins, TO-220FPAC) D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 Table 5. Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0 8 0.016 typ. 0 8 Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 6/11 STTH8R04 Table 6. TO-220AC dimensions Package information Dimensions Ref. Millimeters Min. A H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/11 Package information Table 7. TO-220FPAC dimensions Dimensions Ref. Millimeters Min. A A H B STTH8R04 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 8/11 STTH8R04 Table 8. TO-220AC Ins. dimensions Package information Dimensions Ref. Millimeters Min. A B OI L F b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75 15.90 0.598 a1 a2 B b1 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 5.40 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.189 0.244 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151 A I4 b2 C c2 a1 l2 c1 c2 e a2 M b1 e c1 F OI I4 L l2 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 1.70 0.104 0.044 0.102 0.116 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH8R04 3 Ordering information Part Number STTH8R04D STTH8R04DI STTH8R04FP STTH8R04G STTH8R04G-TR Marking STTH8R04D STTH8R04DI STTH8R04FP STTH8R04G STTH8R04G Package TO-220AC TO-220 Ins TO220FPAC D2 2 Weight 1.86 g 2.3 g 1.64 g 1.48 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape and reel PAK D PAK 4 Revision history Date 11-Mar-2007 Revision 1 First issue. Description of Changes 10/11 STTH8R04 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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